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Effects of Resin Content on Mechanical and Physical Properties of Treated Kenaf Particleboard
Nur Liyana Aifa Mahammad Asri1, Ainil Idzaty Mohamed Anwar2, Nur Atiqah Najib3, Judith Gisip4.
ABSTRACT
Kenaf whole stems were obtained from kenaf plantation located in Chendor,
Cherating, Pahang. The stems were cut into small particles with sizes
ranging between 0.5 mm to 2.0 mm. Kenaf particles were treated using 2 %
NaOH solution. Phenol formaldehyde (PF) adhesive was used to bind the
kenaf particles together with resin contents of 8 and 10 %. The objectives
of this study were to evaluate the effect of resin content on mechanical and
physical properties of treated kenaf particleboard. The boards were cut and
tested according to the Malaysian Standard (MS1787:2004) for furniture
grade particleboards for use in humid condition. Results showed that the
values of modulus of rupture, modulus of elasticity and internal bonding
strength increased with an increase in resin content, while thickness swelling
and water absorption increased with a decrease in resin content. Kenaf
board treated with sodium hydroxide gave the highest value of bending
strength and internal bonding strength compared to untreated particleboard
which acted as a control board. Although all boards did not achieve the
minimum standard values requirement according to the Malaysian standard,
kenaf has been proven to have a great potential as raw materials in the
particleboard industry. Further studies are needed to improve its properties
particularly for exterior applications.
Affiliation:
- Universiti Teknologi MARA Shah Alam, Selangor, Malaysia
- Universiti Teknologi MARA Shah Alam, Selangor, Malaysia
- Universiti Teknologi MARA Shah Alam, Selangor, Malaysia
- Universiti Teknologi MARA Shah Alam, Selangor, Malaysia
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