This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package. 3D model of chip packages is built using GAMBIT and simulated using FLUENT software. The study was made for four chip packages arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package The comparison between three types of material in the term ofjunction temperature has been observed and it was found that the junction temperature of the nanosilver had the lowest junction temperature compared to epoxy and composite polymer. It was also found that the nano-silver had the highest value of thermal conductivity compare to the others. The strength of CFD software in handling heat transfer problems is proved to be excellent.