The need for higher performance of electronic device becomes very important presently. The heat dissipated from the device at high heat flux demand better cooling system for heat removal in order to maintain the performance and reliability of the electronic device. In order to solve this problem, the vapour chamber is introduced as a part of the heat remover device. The vapour chamber in this study has an area of 64 mm X 44 mm. The vapour chamber is a twophase closed flat chamber made of copper Water is enclosed as the working fluid, and five types of wick structure are used in the 5 mm thickness vapour chamber. The experimental results show that the rectangular wick structure gives the lowest thermal resistance. The wick structure with the working fluid and the boiling phenomenon is practically effective for a 45% fill ratio.