Three-dimensional numerical analysis ofheat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation, horizontally mounted on a printed circuit board, in a wind tunnel is carried Ollt using a commercial Computational Fluid Dynamic (CFD) code, FLUENT". The study was made for eight packages with different inlet velocities and package chip powers. The results are presented in term ofjunction temperature for each package IInder different conditions. It is observed that the junction temperature of the packages decreases with increase in inlet air velocity. MoreoveJ; the chip temperatures are observed to be increased with the increase in number of packages as well as increase in chip pOWe/: The predicted results are in good agreement with previous works.