This study investigated the thermal properties of three room temperature curing adhesives containing nano particles which were thixotropic and shear thinning which allowed injection into overhead holes when exposed to different environmental conditions. Viscosity and shear stress of the adhesives were measured as a function of shear rate. The thermal behaviour of the adhesives were measured using dynamic mechanical thermal anylisis following exposures to different temperatures and humidities which included temperatures of 20 degrees Celcius, 30 degrees Celcius and 50 degrees Celcius, relative humidities of 65% RH, 75% RH 95% RH soaked in water at 20 degrees Celcius and placed in the oven at 50 degrees Celcius. The dynamic thermal properties reported include storage and loss modulus, the loss tangent and the glass transition temperature ( Tg ). For nano- and micro-particles filled adhesives, the Tg increased with the temperature increase, even though the adhesives was subjected to high humidity and this was due to further cross-linking. The results showed that room temperature cured epoxies were only partially cured at room temperature.