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Temperature and flux effect on contact angles and intermetallic between Sn-8Zn-3Bi lead-free solder and Cu substrate
Mayappan, Ramani1, Zainal Ariffin Ahmad2.
The influences of temperatures and fluxes on contact angles, intermetallic (IMC) phase and thickness of Sn-40Pb and Sn-8Zn-3Bi solders on copper substrate were investigated. As expected, the contact angle decreases and the intermetallic thickness increases as the temperature increases. The Sn-40Pb solder exhibits a lower contact angles compared to Sn-8Zn-3Bi solder for all the fluxes tested. The Sn-40Pb/Cu system exhibits a single Cu6Sn5 intermetallic. The Sn-8Zn-3Bi/Cu interface exhibits ε(Cu-Zn) and γ-Cu5Zn8 phases and soldering at 280oC exhibits a single γ-Cu5Zn8 phase. Sn-40Pb/Cu gives higher intermetallic thickness compare to Sn-8Zn-3Bi/Cu system when soldering was done at 220oC. On the other hand, the IMC thickness formed by Sn-8Zn-3Bi/Cu system is higher than Sn-40Pb/Cu system for all other temperatures. Although, the fluxes have no significant influence on the thickness of IMC formed, ZnCl2 generally gives lower IMC thickness.
Affiliation:
- Universiti Teknologi MARA, Malaysia
- Universiti Sains Malaysia, Malaysia
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Indexation |
Indexed by |
MyJurnal (2021) |
H-Index
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6 |
Immediacy Index
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0.000 |
Rank |
0 |
Indexed by |
Web of Science (SCIE - Science Citation Index Expanded) |
Impact Factor
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JCR (1.009) |
Rank |
Q4 (Multidisciplinary Sciences) |
Additional Information |
JCI (0.15) |
Indexed by |
Scopus 2020 |
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CiteScore (1.4) |
Rank |
Q2 (Multidisciplinary) |
Additional Information |
SJR (0.251) |
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