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3D modelling of electrical capacitance and ultrasonic sensor integration using finite element method
Jaysuman Pusppanathan1, Ruzairi Abdul Rahim2, Fatin Aliah Phang3, Khairul Hamimah Abasa4, Shafishuhaza Sahlan5, Elmy Johana Mohamad6.
This paper presents a three dimensional (3D) modelling of a dual modality sensor composite which emerges electrical capacitance sensor (ES) and ultrasonic transducer (UT) for process tomography applications. The dual-modality tomography (DMT) setup has employed a customized ES electrodes along with UT on a single-plane. A finite element method is used to analyze the feasibility and the behavior of the DMT setup in 3D environment using COMSOL Multiphysics software. This simulation is performed both in a homogeneous and inhomogeneous conditions to investigate the wave distribution and its pattern thus the simulation results are presented in this paper.
Affiliation:
- Infocomm Research Alliance, Malaysia
- Infocomm Research Alliance, Malaysia
- Infocomm Research Alliance, Malaysia
- Universiti Teknologi Malaysia, Malaysia
- Universiti Tun Hussein Onn Malaysia, Malaysia
- Infocomm Research Alliance, Malaysia
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Indexation |
Indexed by |
MyJurnal (2021) |
H-Index
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6 |
Immediacy Index
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0.000 |
Rank |
0 |
Indexed by |
Scopus 2020 |
Impact Factor
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CiteScore (1.4) |
Rank |
Q3 (Engineering (all)) |
Additional Information |
SJR (0.191) |
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