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Factors identification on optimization of ball placement tool for flip-chip-ball-grid-array product

Annuar Ismail1, Rozzeta Dolah2, Zenichi Miyagi3.
Jurnal Teknologi (Volume 78, No. 1, January 2016, Pages 175 to 179)
Times cited: 0
Market demand on system-on-chip (SoC) using ball-attach technologies, it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). This paper identifies caused of factor which contributes more time to production time. Justification on improving ball-attach module cycle time during high volume activities is explained.
Affiliation:
  1. Universiti Teknologi Malaysia, Malaysia
  2. Universiti Teknologi Malaysia, Malaysia
  3. Meiji University, Japan
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  Journal Coverage
Volume 86, No. 4, July 2024
Volume 86, No. 3, May 2024
Volume 86, No. 2, Mac 2024
Volume 86, No. 1, Jan 2024
Volume 85, No. 6, November 2023

  Indexation
Indexed by MyJurnal (2021)
H-Index 6
Immediacy Index 0.000
Rank 0
Indexed by Scopus 2020
Impact Factor CiteScore (1.4)
Rank Q3 (Engineering (all))
Additional Information SJR (0.191)

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