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Journal of Advanced Manufacturing Technology


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Journal of Advanced Manufacturing Technology

OVERVIEW:

Discipline(s) / Subdiscipline(s):

     1. Engineering & Technology
         - Engineering
         - Computer sciences

E-ISSN: 2289-8107
Print ISSN: 1985-3157
Publisher: Universiti Teknikal Malaysia Melaka
Publication type: Print & Electronic
Publication frequency: 2 time(s) per year
Journal Website: http://jamt.utem.edu.my

Contact Info

Journal of Advanced Manufacturing Technology
Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya,
76100, Durian Tunggal, Melaka,
Malaysia.
Tel: +606-270-2629
Fax: +606-270-1047

email: jamt@utem.edu.my

Journal of Advanced Manufacturing Technology (JAMT) is a peer-reviewed, multidisciplinary international journal, publishing original and high-quality articles covering a wide range of topics in engineering, science and technology. JAMT will provide an excellent platform for knowledge exchange among researchers working in various areas. In addition, it provides an opportunity for the authors or researchers to share research findings and establish networks and collaborations.

Authors are invited to submit original, unpublished papers on all aspects including but not limited to the following technical areas: Manufacturing and Mechanical Engineering; Robotics and Automation; Computer Science and Technology; Manufacturing Management; Technical and Vocational Education and Training (TVET). The manuscript selected for normal issue publication is free of charge. For special issue publication, please contact: jamt@utem.edu.my.

EDITORIAL INFORMATION:

Editor-in-Chief

Saifudin Hafiz Yahaya, Universiti Teknikal Malaysia Melaka, Malaysia

Editorial Board

International Advisory Board
  • Okenwa Okoli, Famu-Fsu College Of Engineering, United State of America
  • Tianfeng Zhou, Beijing Institute of Technology, China
  • Ito Teruaki, Okayama Prefectural University, Japan
  • John Mo, RMIT University, Australia
  • Hu Huang, Jilin University, China
  • Tasneem Pervez, Sultan Qaboos University, Oman
  • Dermot Brabazon, Dublin City University, Ireland
  • Deok-Soo Kim, Hanyang University, Korea
  • Joel Segal, University of Nottingham, United Kingdom
  • Abdul Hakim Halim, Institut Teknologi Bandung, Indonesia
  • Abdul Latif Ahmad, Universiti Sains Malaysia, Malaysia
  • Nukman Yusoff, Universiti Malaya, Malaysia
  • Kamaruzzaman Sopian, Universiti Kebangsaan Malaysia, Malaysia
  • Zamberi Jamaludin, Universiti Teknikal Malaysia Melaka, Malaysia
  • Mohd Hamdi Abd Shukor, Universiti Malaya, Malaysia
  • Ramlee Mustapha, Universiti Pendidikan Sultan Idris, Malaysia
Editorial Board Members
  • Nur Izan Syahriah Hussein, Universiti Teknikal Malaysia Melaka, Malaysia
  • Effendi Bin Mohamad, Universiti Teknikal Malaysia Melaka, Malaysia
  • Muhammad Hafidz Fazli Md Fauadi, Universiti Teknikal Malaysia Melaka, Malaysia
  • Yuhazri Mohd Yaakob, Universiti Teknikal Malaysia Melaka, Malaysia
  • Suriati Akmal, Universiti Teknikal Malaysia Melaka, Malaysia
  • Zanariah Jano, Universiti Teknikal Malaysia Melaka, Malaysia
  • Pay Jun Liew , Universiti Teknikal Malaysia Melaka, Malaysia
  • Mohd Shukor Salleh, Universiti Teknikal Malaysia Melaka, Malaysia

SUBMISSION GUIDELINES:

File:

SUBMISSION PREPARATION CHECKLIST

As part of the submission process, authors are required to check off their submission's compliance with all of the following items, and submissions may be returned to authors that do not adhere to these guidelines. The submission has not been previously published, nor it is under review / considered for publication in any other journal (or an explanation has been provided in Comments to the Editor). The submission file is in OpenOffice or Microsoft Word. Where available, URLs for the references have been provided. The text is 1.5 spaced; uses a 10-point Calibri font; employs italics, rather than underlining (except with URL addresses); and all illustrations, figures, and tables are placed within the text at the appropriate points, rather than at the end. The text adheres to the stylistic and bibliographic requirements outlined in the Author Guidelines. The author(s) confirm that they have full permission for the use of images, formulas, chemical structures and any other copyright materials from their rightful owners. The author(s) also agree to accept full responsibility for the use of these copyright materials and will not hold the Journal and its Publisher responsible for any claims arising from the use of these materials. The authors and all contributors including financiers agree to the Terms & Conditions of the Publisher. The open access article will be distributed based on the terms and conditions of the Creative Commons Attribution (CC BY) license https://creativecommons.org/licenses/by-sa/4.0/

AUTHOR GUIDELINES

You are required to follow the guidelines below for manuscript submission to the Journal of Economics, Finance, Business and Management. Your manuscript must be submitted in a single Microsoft Word document, together with all figures, diagrams and images. In general, the body of your manuscript must contain introduction, materials and methods, results, discussion, conclusion, acknowledgement, disclosures and references. Sections and sub-sections must be numbered systematically. Figures / diagrams / images must be embedded in the manuscript and must appear immediately after it is mentioned in the text. Images must be in image format (JPEG). You can also additionally attach a PDF file of all your figures in one file. Ensure all figures are saved in high resolution for clarity. All figures must be supported by a caption. Captions must be provided separately and not saved together with the images. The captions must be provided in text after the references in the manuscript file. You are encouraged to include a graphical abstract, however, it is not compulsory. The graphical abstract should be attached as a separate file in image format (JPEG/GIF/BMP). Your manuscript should contain the following in sequence: Title that is concise. Names of author and co-authors and their respective affiliations. All the author’s names must be mentioned in full and spelled correctly. All affiliation must be provided with a lowercase superscript after the author’s names and in the front of their respective address. The affiliation must include a full address including the postcode and country. The Corresponding author must be indicated with the (*) sign at the end of the corresponding author’s name. All communications will be only between the journal and the corresponding author. It is also the responsibility of the corresponding author to obtain full permission and consent from all the co- authors regarding the submitted work. All authors are fully responsible to accuracy and reliability of the submitted work. Abstract should not be more than 300 words. References should not be included in the abstract and it must be divided into Introduction, Objectives, Methods, Results and Conclusions. A maximum of 5 keywords. A short title. Page numbers. All abbreviations must be spelled out the first time it’s mentioned in the manuscript. Tables and Figures must be accurately numbered while referred in the text. Authors must agree that they have or have obtained permission to use the images provided in the manuscript. This must be mentioned in the cover letter. You must state any conflict of interest in the disclosure section. If there is none, you must state the following: The authors declare no conflicts of interest in this work. Ensure that the references used throughout the manuscript is the APA (American Psychological Association) Style. Acknowledgements should be included before references. You can mention your funding agencies or sources and include the respective grant numbers in this section.
  Journal Coverage




  Indexation
Indexed by MyJurnal (2020)
H-Index 2
Immediacy Index 0.000
Rank 0
Indexed by Scopus 2020
Impact Factor CiteScore (0.7)
Rank Q4 (Industrial and Manufacturing Engineering))
Q4 (Management of Technology and Innovation)
Q4 (Automotive Engineering)
Q4 (Control and Optimization)
Q4 (Computer Networks and Communications)
Q4 (Software)
Q4 (Hardware and Architecture)
Additional Information SJR (0.221)

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